ULSI Ag Interconnects Using Electroplating Deposition.

Modeling and Characterization of High Frequency Effects in ULSI Interconnects

This paper discusses the accurate modeling of resistance R, inductance L and capacitance C in sub-100nm process node and their impacts on high frequency effects such as delay, crosstalk, and power/ground bounce. Models of interconnect (wire) resistances increase due to electron scattering at the surface and grain boundaries, and coupling capacitance of high aspect ratio interconnects for sub100...

Unveiling the electromigration physics of ULSI interconnects through statistics

Electromigration is an important failure phenomenon in ULSI. There are several underlying physical mechanisms in an electromigration process depending on the stress conditions. In this work, we use various statistical techniques to investigate the number of such mechanisms for a given set of electromigration data. The statistical distribution of each mechanism can be found and the failure units...

Electroless Deposition and Electroplating of Metals

A New Analytical Thermal Model for Multilevel ULSI Interconnects Incorporating Via Effect

This paper presents a compact analytical model for estimating the temperature rise of multilevel ULSI interconnects incorporating via effect. For the first time, an analytical expression is derived for the via correction factor, η, which quantifies the effect of via separation on the effective thermal conductivity of ILD (inter-layer dielectrics), k ILD,effective, with k ILD,effective = k ILD/η...

Deposition of Few Layer Graphene on Plastic Substrate for Using Conductive Layer at Metal Electroplating